Spire Releases TherMax Eclipse CPU Cooler

Spire's TherMax Eclipse

Spire has launched the TherMax Eclipse CPU cooler,building on the success of its predecessor, the TherMax. Measuring 131× 70 × 152 mm, the black coated TherMax Eclipse features five 8mmcopper U-shaped direct touch heat-pipes, 46 “stamped” aluminium finsand pre applied BlueFrost thermal compound on its base.


Side Profile





Base Plate


Accessories

Fullycompatible with Intel's LGA 775, 1156 and 1366 and AMD's Socket 939,AM2/AM2+ and AM3 processors, the cooler comes equipped with two“Blackstar” 120mm ball bearing fans running at speeds of up to 2200 RPMat 29.0 dBA. The cooler also comes bundled with anti-vibration rubberfan mounts for quiet operation. Available in December, Spire has yet toconfirm the pricing, so stay tuned for more updates.


Features:

Five (5) 8mm all copper U-shaped direct touch heat-pipesStraight lined heat-pipes allowing air to easily pass through46 stamped Aluminum wide fins for best surface rateBlack coated heat-sink to preserve killer looks from oxidationTwo (2) 120mm BlackStar 9 blade fan designHigh Quality, Long MTBF Japanese Ball bearingAnti-Vibe universal rubber fan mountsSupports 775/1156 & 1366 incl. Intel Core i7 Extreme 150W
News via [Tcmagazine]

Scientists make breakthrough in thermal cloaking technology

Scientists have made a breakthrough in demonstrating how technology can be developed to make people or objects appear invisible to thermal-imaging devices, bringing us one step closer to science fiction-style cloaking.

The researchers at the Institut Fresnel in France have shown how optical cloaking using transformation optics can be applied in a way to prevent heat from being seen by heat-sensing equipment, effectively masking the object from detection."We can design a cloak so that heat diffuses around an invisibility region, which is then protected from heat," said Dr. Guenneau from Institut Fresnel. "Or we can force heat to concentrate in a small volume, which will then heat up very rapidly."The technology could potentially be used in multiple fields, including by the military and criminals. Soldiers could use it to plan stealthier attacks, while thieves could use it to hide from the thermal cameras on police helicopters, providing, of course, they can steal the technology in the first place.The military has already taken advantage of similar technology to make a tank look like a car to heat-sensing devices. While it does not make it completely invisible, it does recreate the shape of the device in terms of generated and detected heat, leading to new tactics in warfare.Scientists have been trying to discover ways to develop an invisibility cloak for a number of years now, an idea that was once thought to be impossible, but now looks limited only by time and research.Source: BBC

Motorola Alpha leaked, could be Motorola CLIQ 2

When we all thought that T-Mobile has showcased every product from CES 2011, it looks like that is not all true. From internal documents that were recently leaked, it looks like there is a new Motorola phone by the name Alpha. From the screenshot, both the Motorola Alpha and Motorola CLIQ appeared on the same page.

Reports stated that Motorola Alpha could just be a temporary name for Motorola CLIQ 2, as it has long been known as "Begonia". Moreover, it is obvious that smartphones care categorized accordingly, and for Motorola Alpha to be on the same page as CLIQ would already mean the new phone could be the successor. We would only find out when T-Mobile officially announce the Motorola CLIQ 2.

Source: imobile.com.cn

New HP Notebook Dv2 Brings The Zen With Athlon Neo

(Hewlett-Packard Japan) HP Japan has announced their newest lineup for notebooks- HP Pavillion dv2.



The design of the notebook boasts HP's imprint design - Zen Kirameki, which claims to have a zen design.

With a stylish looking design, the internals are packed with AthlonNeo MV-40 (1.60GHz), Memory 2GB(maximum 4GB), HDD 320GB, ATIMobility Radeon HD 3410 (512MB), DVD drive, 1280 × 800 resolution on a 12.1 inch Wide-LCD display. dv2 will be pre-installed with Windows Vista Home Premium.

Small and powerful, it is definitely a strong contender ascompared to the netbook models which comes with the standard Atomconfiguration.

MSI's upcoming A75A-GD55 motherboard pictured

So far MSI has only officially unveiled a pair of AMD A75 motherboards, the A75A-G35 and the A75MA-G55, but the company should have at least another four models coming. VR-Zone has managed to get hold of some exclusive pictures of the upcoming A75A-GD55 model which will be MSIs high-end A75 motherboard and possibly also the most expensive model in the line-up.

We dont quite understand what MSI has done here though, as the A75A-GD55 is very similar to the A75A-GD35, although the PCB is a lot wider while remaining nearly void of components past the memory slots. In fact, at first glance the only obvious difference between the two models is that the A75A-GD55 has gained two memory slots for a total of four. The power connector and Voltage regulation for the memory has been moved further out on the PCB alongside with a pin header and a fan header, but theres really nothing much else here and it seems like the extra PCB was simply added to allow for the screw holes.

MSI has changed the chokes for its SFC branded ones over the regular chokes found on the A75A-GD35 and theres a larger heatsink on the MOSFETs. The slot layout remains the same with a two x16 PCI Express slots of which the lower one has four lanes of bandwidth at its disposal, three x1 PCI Express slots and two PCI slots. The internal USB 3.0 pin-header is still in the same awkward position and MSI decided to keep the jumper blocks for switching between DVI and HDMI output, which is really disappointing and a feature we wouldnt expect to see on a board this far up in MSIs product range.

The rear I/O also remains unchanged with a pair of PS/2 ports, four USB 2.0 ports, two USB 3.0 ports, a Gigabit Ethernet port, 7.1-channel analogue audio jacks and a D-Sub, DVI and HDMI port. We cant but to feel that MSI couldve done better, but at least the good news is that the price difference between the A75A-GD55 and the A75A-GD35 is very small as we found a couple of European online retailers listing the A75A-GD55 for around €80 (S$140) whereas the A75A-GD35 is listed for around €75 (S$131) and while the A75A-GD55 is a better choice in terms of future upgradeability of the memory, it has little else to offer to its advantage.

OCZ 1GB PC3500 amp; PC-3700 Memories

OCZ Technology Group today announced the release of PC-3500 and PC-3700 1 GBUnbuffered DDR memory modules and 2 GB Dual Channel kits in its Performanceseries line of DDR memory.

Each PC-3500 module and Dual Channel kit features an integrated copperheatspreader to aid in heat dissipation and are rated for CL3-3-3-8 (read:CAS-tRCD-tRP-TRAS) latencies at 2.7 volts. OCZ PC-3700 modules and Dual Channelkits are rated for CL 3-4-4-8 latencies at 2.7 volts. Both the PC-3500 andPC-3700 1 GB DDR memory modules feature High Density Low Compensation (HDLC)technology to allow for higher frequencies and more aggressive timings.

In order to ensure that OCZ PC-3500 1 GB unbuffered modules and Dual Channelkits perform to OCZ’s exacting performance and quality standards, all modulesand Dual Channel kits are hand-tested by OCZ technicians using the Asus P4C800Deluxe mainboard before they are shipped. OCZ PC-3500 and PC-3700 1 GBunbuffered modules are covered by OCZ’s no-hassle lifetime warranty andtechnical support service.

“OCZ is pleased to extend its performance line to include PC-3500 and PC-37001 GB modules and 2GB kits,” said Dr. Michael Schuette, director of technologydevelopment with OCZ Technology Group. “OCZ has spent a considerable amount oftime developing our PC-3500 and PC-3700 modules and we are very excited of thelevel of performance and stability we have been able to achieve.”

OCZ PC-3500 and PC-3700 1 GB modules and Dual Channel kits will beginshipping immediately. For price and availability please check with your favoriteOCZ retailer. For more information o­n OCZ 2 GB PC-3500 Dual Channel kits,please visit the OCZ product page here. More information about OCZ 2 GB PC-3700Dual Channel kits can be found here.

Product Link:

http://www.ocztechnology.com/products/memory/OCZ_DDR_PC-3500_Dual_Channel
http://www.ocztechnology.com/products/memory/OCZ_DDR_PC-3700_Dual_Channel

Next Gen. PCI Express Spec Doubled To 5GT s

The PCI-SIG®, the Special Interest Group responsible for PCI Express™architecture, announced today that the data rate for the next planned revisionof the PCI Express specification will be 5 Giga transfers per second. This newspecification extends the performance capability of its flagship I/Ointerconnect architecture to meet the anticipated system requirements acrosscomputer and communication industry applications. The doubling of the data ratefollows historical performance increases for I/O specifications in the industry.

The PCI-SIG board of directors considered market requirements and technicalanalysis of a range of data rates to obtain the most feasible, highestperformance, backward compatible solution within the current PCI Expressecosystem. Platform implementation cost, high-volume manufacturability, systemtopologies, validation and interoperability were the key considerations studiedby the PCI-SIG board members in the process to extend the PCI Express data rateto 5GT/s.

Many of the leading electrical experts who developed the PCI Express 1.0aspecifications have been chartered to draft the new specification. The PCI-SIGexpects to deliver the new specification in the second half of 2005 in time forproduct introductions beginning in 2007.

"The PCI-SIG continues to deliver on the promise of timely PCI Expressenhancements to meet the ever-growing bandwidth requirements of the I/Oindustry," said Tony Pierce, PCI-SIG chairman. "The board of directorsthoughtfully considered an array of technical and market data and arrived at thebest decision for the next revision of the PCI Express architecture. We plan todeliver the new 5GT/s PCI Express specification consistent with our members’expectations for 100% backward compatibility, low-cost manufacturability andworld-class compliance and interoperability."

"The new 5GT/s PCI Express specification will enable the required performanceboost for bandwidth-hungry applications such as cinema-quality graphics andmultimedia, enterprise servers and storage, and multi-gigabit networking," saidAjay Bhatt, chairman of the PCI Express steering committee, responsible formanaging the technical development and coordination of PCI Expressspecifications. "The electrical specification will introduce evolutionarymethodologies to meet the technical challenges of running at 5 Giga transfersper second while maintaining compatibility with existing system topologies andsilicon processes."